COMPUTEX 2026 Taipei Concludes; KingBank Showcases Full Lineup of AI High-Capacity Memory, PCIe High-Speed SSDs & Chips Made with Domestic IC Die Universal AI reshapes the new landscape of the global electronics industry

COMPUTEX 2026 Taipei Concludes; KingBank Showcases Full Lineup of AI High-Capacity Memory, PCIe High-Speed SSDs & Chips Made with Domestic IC Die

Universal AI reshapes the new landscape of the global electronics industry

From June 2 to 5, the 45th Taipei Computer Show (COMPUTEX 2026) was held simultaneously at Taipei Nangang Exhibition Center and Taipei World Trade Center. Centered on the core theme "AI Together", the show hit record highs in both exhibition scale and number of professional buyers. It has fully transformed from a traditional PC hardware expo into a core business platform covering the entire global AI industrial chain, sending four major new signals for industrial development: computing power, robotics, high-speed interconnection, and low-carbon sustainability.

Images sourced from official promotional materials of COMPUTEX 2026

At COMPUTEX 2026, KingBank, a domestic Chinese storage brand, set up its booth on the 4th floor of Hall 2 at Nangang Exhibition Center in the DIY hardware zone. The brand presented three complete product lines — AI high-capacity memory, PCIe 5.0 high-speed solid-state drives, and new products built with domestic memory die — for global distributors, AI workstation manufacturers and gaming DIY enthusiasts. Its core offerings are high-bandwidth, low-latency storage solutions optimized for AI PCs and local large-model creative devices, making it one of the few Chinese brands on-site to extensively display storage products powered by domestic DRAM die.

KingBank unveiled its flagship Stellar Blade Armor DDR5 memory built on 24Gb domestic memory die, engineered exclusively for personal local AI computing devices:

Capacity Specifications: Single 24GB modules and 48GB dual-channel kits, supporting a maximum 96GB massive memory configuration for AI image generation, video rendering and local large model deployment;
Frequency & Timing: Versions with domestic die run at 6000MT/s CL36; specially-screened SK Hynix A-die variants reach 7200/7600MT/s with ultra-low latency as low as CL28;
Hardware Design: 2mm thickened aluminum heat spreaders, 10-layer PCBs and independent PMIC power management chips deliver stable temperature control under prolonged heavy AI workloads;
Lighting Ecosystem: Full-coverage ARGB synchronized light strips compatible with lighting software from ASUS, MSI and Gigabyte, balancing aesthetic appeal for gaming and professional productivity needs.

Multiple physical AI workstations were set up for live demonstrations, running open-source local large language models and 4K/8K video editing software to visually showcase how high-capacity memory eliminates stuttering during AI task loading.

KingBank brought its full-stack AI storage portfolio to COMPUTEX 2026, with domestic high-capacity DDR5 memory as its star highlight. Its products cover all scenarios including consumer gaming, AI content creation and edge industrial storage. The brand not only demonstrated the technical maturity of domestic memory chips to the global market, but also perfectly aligned with the expo’s core industry trend of "on-device AI implementation". It stands out as a benchmark domestic hardware brand expanding global reach at this year’s COMPUTEX.